Product & Services
Mipot offers services and products made in a clean room with Microelectronics technology.
The term microelectronic technology intend to indicate, in the context of the industrial manufacturing processes of integrated circuits called HYBRIDS,
made on a ceramic basis (aluminium and beryllium oxides, aluminium nitrides) which in many cases are used in telecommunications, avionics and military applications, medical.
Global Approch for continuous improvement
Supplier management, Vendor Scouting, Volume contracting
Incoming, Traceability system, automatic component management
Bonding passive and active components with conductive resin, DIE bonding with non-conductive resin
Traceability of lots, PCB laser marked, traceability components and automatic Warehouses
Bal Wedge bonding: Gold wire 25µ, 33µ, 150µ
Wedge Wedge bonding: Aluminum wire 150µ
Automatic depaneling by laser, manual depaneling with rotary cutter and punch cutter, washing electronic boards
Selective, immersion, spray UV conformal coating
Automatic and Manual Test, Burn-In, Run-In Test customed for each Customer
Low and flexible volume
Sealing on nitrogen with helium
Sealing check with Helium
Stabilization brake, Temperature Cycling, Costant Acceleration, Pre Burn-In, Electrical Test, Run-In, Final Electrical Test, CQ Controll.
Packaging upon with customer specifications and world wide door-to-door fast delivery
Product assurance, Maintance, analysis process