The THT (Through-hole technology) involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side either by manual assembly by hand placement or by the use of automated insertion mount machines.
The processes used in Mipot are:
- Preformation of THT components
- Laser welding of THT components
- Wave soldering of THT components
- Hand soldering of THT components