The SMT (Surface Mount Technology) has largely replaced the through-hole technology construction method because the SMD (Surface Mounting Device) components are mounted or placed directly onto the surface of printed circuit boards without the drilling. This technology offers several advantages:

  • considerable reduction of the size of the components and therefore lower size of the machines
  • maximum automation and speed of assembly procedures
  • no waste due to the necessity of cutting excess leads
  • the components can be mounted on both sides of the printed circuit board

The processes used in Mipot are:

  • Mounting of SMD components dimensions down to sizes 0201
  • Package SOIC, QFN, QFP, BGA
  • PCB Laser Marking
  • Optical Inspection AOI